ems technologies contract manufacturers
PCB Assembly

Our Manufacturing Capabilities Include:

    Thru Hole Assembly
    • Mixed Technology
    • Multiple process for your most demanding parts

    SMT Assembly
    • Mixed Technology
    • Double-Sided SMT
    • Fine Pitch (to 0.01mil)
    • BGA & uBGA & X-Ray Reporting

    Hardware and System Level Assembly
    • Pre-Assembly
    • Case/Wiring Assembly
    • Full Product Assembly

    Testing
    • In-circuit Testing
    • Functional Testing
    • Electronic data yield tracking and reporting

    Component Programming
    • Full Rev Control and database storage

    New Product Introduction
    • Quick turn prototypes
    • Documentation review including searching for and eliminating and errors
    • Rapid coordination and incorporation of changes